PRD1513 - 2um LS LPCVD Nitride
Low Stress LPCVD Nitride deposited on silicon wafers. Processed in our class 100 cleanroom to ensure a premiμm quality film. This is a furnace process so both surfaces of the wafers will have Nitride. Low Stress LPCVD Nitride film stress <250MPa Tensile and Refractive Index 2.20 +/- 0.05nm @ 632.8nm. Product to ship with film Certificate of Conformance. Need something different? Please email sales@roguevalleymicro.com for a quote.
| -Material: Silicon |
| -Diameter: 150mm |
| -Type/Dopant: P/Boron |
| -Orientation: <100> |
| -Resistivity: >1 ohm-cm |
| -Thickness - W: 675+/-25um |
| -Surface Prep: SSP |
| -Flat/Notch: Flat, Semi Standard |
| -Film Type: Low Stress LPCVD Nitride |
| -Film Stress: <250 MPa Tensile |
| -Film Thickness: 2um +/-5% |
| -Sides Processed: Both |
| -Quantity: 1 lot = 25 wafers |